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挠性板技术参数
 

Flex/Rigid-Flex PCB

1

Layers

Layer Count/flex layer:36/10

2

Normal Base Materials

PI for Flex

FR4 for Rigid

3

Normal Base Film Thickness

12.5um to 100um for Flex

0.1mm to 3.2mm for Rigid

4

Normal Coverlay Thickness

12un to 25um

5

Normal Adhesive Thickness

12un to 35um

6

Base Copper Thickness

1/2oz,1 oz, 2oz, 3oz or more (RA/ED Copper)

7

Stiffener Materials

PI, FR4

8

Min.Finished Thicness

0.075mm/0.025"(Single Sided)

0.13mm/0.005"(Double Sided

0.31mm/0.012"(4Layers)

9

Max.Panel Size

250mmx400mm/9.8"x15.7"

10

Min.Drill Diameter

0.15mm/0.006"

11

Blind or Buried Vias

Yes for Rigid_Flex Board

12

Min.Line width/spacing

0.05mm/0.002"

13

Min.Bonding Pitch

0.10mm/0.004"(Center to Center)

14

Min.SMT Pitch

0.40mm/0.016"(Center to Center)

15

Surface Finishing

Plated soft Gold over Nickel for Ultrassonic Bonding

Plated soft Gold over Nickel for Thermalsonicc Bonding

Plated selective hard Gold over Nickel for commector

ENIG (Electroless Nickel &lmmersion Gold

Hot Air Solder Leveling

lmmersion Tin

Silver lnk or Carbon lnk Printing

Organic Soldersbility Preservative (ENTEK)

16

Solder Mask

Liquid Photoimageble Solder Mask

17

Outline Fabrication

Precision Punching

CNC Routing for Rigid part only

CNC V-scoring for Rigid part only

18

General Tolerance

Min.Hole Diameter Tolerance ±0.05mm

Min.Hole Position Tolerance ±0.05mm

Min.Pattem Registraion Tolerance ±0.05MM

Min. Soler Mask Registraion Tolerance ±0.075mm

19

Genntal Capabiliti

Min.Annular ring 0.025mm

Min.Solder Mask Bridge(LPI) 0.1mm

Plated Gold Thickness 0.025um~3um

Immersion Gold Thivkness 0.025um~0.1um

Twist and Warp : 1%

20

E-Testing

Volatge :24V~3000V

Continuity :5-100ohms

Flying Probe E-tester and AOI available

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