Flex/Rigid-Flex PCB |
1 |
Layers |
Layer Count/flex layer:36/10 |
2 |
Normal Base Materials |
PI for Flex |
FR4 for Rigid |
3 |
Normal Base Film Thickness |
12.5um to 100um for Flex |
0.1mm to 3.2mm for Rigid |
4 |
Normal Coverlay Thickness |
12un to 25um |
5 |
Normal Adhesive Thickness |
12un to 35um |
6 |
Base Copper Thickness |
1/2oz,1 oz, 2oz, 3oz or more (RA/ED Copper) |
7 |
Stiffener Materials |
PI, FR4 |
8 |
Min.Finished Thicness |
0.075mm/0.025"(Single Sided) |
0.13mm/0.005"(Double Sided |
0.31mm/0.012"(4Layers) |
9 |
Max.Panel Size |
250mmx400mm/9.8"x15.7" |
10 |
Min.Drill Diameter |
0.15mm/0.006" |
11 |
Blind or Buried Vias |
Yes for Rigid_Flex Board |
12 |
Min.Line width/spacing |
0.05mm/0.002" |
13 |
Min.Bonding Pitch |
0.10mm/0.004"(Center to Center) |
14 |
Min.SMT Pitch |
0.40mm/0.016"(Center to Center) |
15 |
Surface Finishing |
Plated soft Gold over Nickel for Ultrassonic Bonding |
Plated soft Gold over Nickel for Thermalsonicc Bonding |
Plated selective hard Gold over Nickel for commector |
ENIG (Electroless Nickel &lmmersion Gold |
Hot Air Solder Leveling |
lmmersion Tin |
Silver lnk or Carbon lnk Printing |
Organic Soldersbility Preservative (ENTEK) |
16 |
Solder Mask |
Liquid Photoimageble Solder Mask |
17 |
Outline Fabrication |
Precision Punching |
CNC Routing for Rigid part only |
CNC V-scoring for Rigid part only |
18 |
General Tolerance |
Min.Hole Diameter Tolerance ±0.05mm |
Min.Hole Position Tolerance ±0.05mm |
Min.Pattem Registraion Tolerance ±0.05MM |
Min. Soler Mask Registraion Tolerance ±0.075mm |
19 |
Genntal Capabiliti |
Min.Annular ring 0.025mm |
Min.Solder Mask Bridge(LPI) 0.1mm |
Plated Gold Thickness 0.025um~3um |
Immersion Gold Thivkness 0.025um~0.1um |
Twist and Warp : 1% |
20 |
E-Testing |
Volatge :24V~3000V |
Continuity :5-100ohms |
Flying Probe E-tester and AOI available |
