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Technical |
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Rigid PCB Production Capacity |
Rigid PCB |
SERIAL |
ITEM |
TECHNICAL DATA |
1 |
Types of Products |
HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB,FPC, Teflon Board, and HDI |
2 |
Layers |
0-50(layers) |
3 |
Materials |
FR-4,High Tg FR-4,Halogen free,High Frequency (Rogers,Arlon,Taconic,Nelco...)etc. |
4 |
Max Board Size |
22.5″* 49″ |
5 |
Board Thickness |
0.2mm-8.0mm |
6 |
Copper Clad(Max.) |
6 oz(outer)/4 oz(inner) |
7 |
Min line Width/space |
0.075mm 3mil |
8 |
Drill Size Mechanical (min) |
0.10mm 4mil |
9 |
Drill Size Laser(min) |
0.10mm 4mil |
10 |
PTH Wall Thickness |
0.020mm 0.8mil |
11 |
PTH dia tolerance |
±0.075mm ±3mil |
12 |
NPTH hole dia tolerance |
±0.05mm ±2mil |
13 |
Hole Position Deviation |
±0.05mm ±2mil |
14 |
Outline Tolerance |
±0.10mm ±4mil |
15 |
S/M Pitch |
0.08mm 3mil |
16 |
Insulation Resistance |
1E+12Ω(Normal) |
17 |
Test Voltage |
50~300V |
18 |
Max Aspect Ratio |
40:1 |
19 |
Thermal Shock |
3x10Sec@288 ℃ |
20 |
Warp and Twist |
≤0.7% |
21 |
Current breakdown |
10A |
22 |
Electric Strength |
>1.3KV/mm |
23 |
Peel Strength |
1.4N/mm |
24 |
Solder Mask Abrasion |
≥6H |
25 |
Flammability |
94V-0 |
26 |
Impedance Control |
+/-10%(Differential) |
27 |
Buried Via |
Yes |
28 |
Blind Via |
Yes |
29 |
HDI |
1+N+1, 2+N+2, 3+N+3, 4+N+4 4mil Via hole |
30 |
Surface Finished |
HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Flash Gold, Golden Finger, OSP, Lead free HASL etc | |
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